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  product structure silicon monolithic integrated circuit this product is not designed for protection against radioactive rays . 1/ 10 tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 tsz22111 ? 14 ? 001 www.rohm.com voltage detector ic series bipolar voltage detector ics bd47 xx series general description the bd47 xx series is a voltage detector ic , developed to prevent system errors at transient state, when the power of cpu or logic circuit switches on/off or in cases of momentary shut down. these ics consist of three terminals (power supply, gnd and reset output) to detect power supply voltages and outputs reset signals of various systems. these ics are ultra-compact and have low current consumption , making them ideal for portable products. features ? high accuracy detection ? low current consumption ? very small package ? open collector l reset output ? package ssop5 is similar to sot- 23 -5 (jedec) key specifications ? detection voltage range: 1.9v to 4.6v (typ.) 0.1v steps ? high accuracy detection voltage: 1% ? low current consumption: 1.6a (typ.) ? operating temperature range: -40c to +75c package ssop5 2.90mm x 2.80mm x 1.25mm applications circuits using microcontrollers or logic circuits that require a reset. typical application circuit connection diagram ssop5 top view pin descriptions pin no. symbol function 1 n.c. unconnected terminal 2 sub substrate* 3 gnd gnd 4 v out reset output 5 v dd power supply voltage * substrate pin should be connected with gnd gnd bd47xx series reset gnd v out v dd v dd cpu micro-controller c l r l n.c. sub gnd v out v dd lot. no marking datashee t downloaded from: http:///
2/ 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 ordering information lineup marking detection voltage part number marking detection voltage part number marking detection voltage part number b2 4.6v bd4746 br 3.6v bd4736 bh 2.6v bd4726 b1 4.5v bd4745 bq 3.5v bd4735 bg 2.5v bd4725 bz 4.4v bd4744 bp 3.4v bd4734 bf 2.4v bd4724 by 4.3v bd4743 b4 3.3v bd4733 be 2.3v bd4723 bx 4.2v bd4742 bn 3.2v bd4732 bd 2.2v bd4722 bw 4.1v bd4741 bm 3.1v bd4731 bc 2.1v bd4721 bv 4.0v bd4740 bl 3.0v bd4730 bb 2.0v bd4720 bu 3.9v bd4739 bk 2.9v bd4729 ba 1.9v bd4719 bt 3.8v bd4738 bj 2.8v bd4728 bs 3.7v bd4737 b3 2.7v bd4727 (sot- 23 - 5) b d 4 7 x x g - t r part reset voltage value package packaging and number 19 : 1.9v g : ssop5 forming specification 0.1v step tr : embossed tape 46 : 4.6v and reel downloaded from: http:///
3/ 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol limit unit power supply voltage v dd -0.3 to +10 v output voltage v out -0.3 to +10 v output current io 60 ma power dissipation *1 *2 pd 540 mw operation temperature range topt -40 to +75 c ambient storage temperature tstg -55 to +125 c *1 reduced by 5.4mw/ c when used over 25c. *2 when mounted on rohm standard circuit board (70mm70mm1.6mm , glass epoxy board). electrical characteristics (unless otherwise specified ta=25c) parameter symbol condition limit unit min. typ. max. detection voltage v det v dd =h ? l rl=4.7k ? v det (t) 0.99 v det (t) v det (t) 1.01 v vdet=2.5v ta=+25c 2.475 2.5 2.525 ta =-40c to 75c 2.418 - 2.584 vdet=3.0v ta=+25c 2.970 3.0 3.030 ta =-40c to 75c 2.901 - 3.100 vdet=3.3v ta=+25c 3.267 3.3 3.333 ta =-40c to 75c 3.191 - 3.410 vdet=4.2v ta=+25c 4.158 4.2 4.242 ta=-40c to 75c 4.061 - 4.341 temperature coefficient of detection voltage v det / ? t r l =4.7k ? ta=- 20 to +75c designed guarantee - 0.01 - %/ c detection hysteresis voltage ? v det r l =4.7k ? , v dd =l ? h ? l 30 50 100 mv transfer delay time h t plh c l =100pf r l =4.7k ? *1 - 20 50 s transfer delay time l t phl c l =100pf r l =4.7k ? *2 - 60 120 s reset output voltage l v ol v dd =v de t (min.)-0.05v, r l =4.7k ? - 0.1 0.4 v circuit current on icc1 v dd =v det (min.)-0.05v, r l = - 1.5 3.0 a circuit current off icc2 v dd =v det (typ.)/0.85v, r l = - 1.6 3.2 a operating voltage range v opl r l =4.7k ? v ol 0.4v - 0.65 0.85 v output leak current i leak v dd =v out =10v - - 0.1 a reset output current l i ol vo=0.4v, v dd =v det (min.)-0.05v 3.0 15.0 - ma v det (t) :standard detection voltage(1.9v to 4.6v, 0.1v step r :pull-up resistor to be connected between v out and power supply. c l :capacitor to be connected between v out and gnd. *1 t plh :v dd =(v det (typ.)-0.4v) ? (v det (typ.)+0.4v) *2 t phl :v dd =(v det (typ.)+0.4v) ? (v det (typ.)-0.4v) design guarantee. (outgoing inspection is not done on all product s) downloaded from: http:///
4/ 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 block diagram fig.1 bd47xx series vref v out v dd gnd 5 4 3 downloaded from: http:///
5/ 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves fig.2 circuit current 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10 v dd supply voltage v dd [v] circuit current i cc [a] bd4729g icc1=1.34a icc2=1.46 a 0 100 200 300 400 500 600 700 800 0 5 10 15 20 25 30 output voltage v out [mv] "low" output current i ol [ma] bd4729g i ol =12.194ma at vo=400mv fig.3 low output current fig.4 i/o characteristics 0 1 2 3 4 5 6 0 1 2 3 4 5 6 v dd supply voltage v dd [v] output voltage v out [v] bd4729g v det =2.95v S v det =50mv v det =2.90v 0 100 200 300 400 500 600 700 800 900 1000 0 0.5 1 1.5 2 2.5 v dd supply voltage v dd [v] output voltage v out [mv] bd4729g v opl =0.675v fig.5 operating limit voltage bd4729 bd4729 bd4729 bd4729 downloaded from: http:///
6/ 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued fig.7 circuit current when on 0.0 0.5 1.0 1.5 2.0 2.5 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[ ? ] circu it c urr ent wh en on i cc1 [ma] bd4729g fig.8 circuit current when off 0.0 0.5 1.0 1.5 2.0 2.5 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[ ? ] circu it c urr ent wh en off i cc2 [ma] bd4729g fig.9 operating limit voltage 0.4 0.5 0.6 0.7 0.8 0.9 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[ ? ] minimum operation vo l tage v opl [v] bd4729g fig.6 detection voltage 2.3 2.5 2.7 2.9 3.1 3.3 3.5 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[ ? ] detection voltage v det [v] bd4729g -0.007%/ ~ ~ bd4729 bd4729 bd4729 bd4729 downloaded from: http:///
7/ 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued 0 100 200 300 400 500 0 1 2 3 4 5 "low" output current i ol [ma] output voltage v out [mv] bd4729g ta=25 ? ta=75 ? ta=-20 ? fig.10 output saturation voltage bd4729 downloaded from: http:///
8/ 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 application information explanation of operation bd47 xx series has threshold voltages namely the detection volt age and release voltage. as the voltages applied to the input reach their respective thresholds , the output switches from high to low and from low to hig h. the release voltage has a hysteresis that is the value of the detectio n voltage +50mv (typ.), preventing chattering in the output. when the input is grea ter than the release voltage, the output is in a high s tate. when the input decreases from that state, the output switches to low upon reaching the detection voltage. when the input is less than the detection voltage, the output is in a low state. wh en the input increases from that state, the output switches to high upon reaching the release voltage. additionally, at least 0.85v input voltage is required for the circuit to function as expected. when the input falls below the operating limit voltage, the output becomes unstab le. 1 when the power supply is turned on, the output is still unstable until it reaches the operating limit voltage (v opl ) with a given time t phl . therefore it is possible that the reset signal is not outputte d when the rise time of v dd is faster than t phl . 2 when v dd is greater than v opl but less than the reset release voltage (v det + v det ), the output voltages will switch to low. 3 if v dd ex ceeds the reset release voltage (v det +v det ) then v out switches from l to h after t plh . 4 if v dd drops below the detection voltage (v det ) when the power supply is powered down or when there is a power supply fluctuation, v out switches to l (with a delay of t phl ). 5 the potential difference between the detection voltage a nd the release voltage is known as the hysteresis width (v det ). the system is designed such that, the output does not toggle with power supply fluctuations within this hysteresi s width, malfunctions due to noise are prevented. please be aware that when there is resistance on the powe r supply line, the detection voltage varies with voltage drops caused by the ic current consumption. please connect a capacitor between v dd and gnd when the power supply line has high impedance. fig.11 timing waveform v dd v det + v det v det v opl 0v t phl v out t plh t phl t plh v ol v oh v dd downloaded from: http:///
9/ 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 circuit applications the following is an example of an application circuit u sing reset ic for normal power supply detection. bd47 xx series requires a pull up resistor on the output terminal. the pul l up resistor value should be decided depending on th e application, with enough consideration of power supply le vel and output current capability. when a capacitor is pla ced at the output terminal, to delay the output time or to remove n oise, the output will become slower during starting or stop ping. please be careful in considering the appropriate value for pull up resistors, output current, and capacitor when inse rting a bypass capacitor between input and gnd. please be aware th at if an extremely large capacitor is used, the response time will become excessively slow. fig.12 circuit applications vref v out v dd gnd 5 4 3 bd47xx series v dd reset pin microcontroller downloaded from: http:///
10 / 10 bd47 xx series tsz02201-0r7r0g300020-1-2 ? 20 16 rohm co., ltd. all rights reserved. 21.jun.2016 rev.007 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings operating the ic over the absolute maximum ratings may damag e the ic. the damage can either be a short circuit between pins or an open circuit between pins. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute max imum ratings. 2) ground voltage the voltage of the ground pin must be the lowest voltage o f all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even duri ng transient condition. 3) recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 4) bypass capacitor for noise rejection to help reject noise, put a 1f capacitor between v dd pin and gnd and 1000pf capacitor between v out pin and gnd. be careful when using extremely big capacitor as transient res ponse will be affected. 5) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is moun ted in a wrong orientation or if pins are shorted togeth er . s hort circuit may be caused by conductive particles caught betwe en the pins. 6) operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 7) the v dd line impedance might cause oscillation because of the dete ction current. 8) a v dd to gnd capacitor (as close connection as possible) should be used in high v dd line impedance condition. 9) lower than the mininum input voltage puts the v out in high impedance state, and it must be v dd in pull up (v dd ) condition. 10) external parameters the recommended parameter range for r l is 2 k to 1m. there are many factors (board layout, etc) that can affect characteristics. please verify and confirm using practical appli cations. 11) power on reset operation please note that the power on reset output varies with the v dd rise time. please verify the behavior in the actual operation. 12) testing on application boards when testing the ic on an application board, connecting a capac itor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or remov ing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during asse mbly and use similar precautions during transport and storage. 13) rush current when power is first supplied to the ic, rush current may flow i nstantaneously. it is possible that the charge current to the parasitic capacitance of internal photo diode or the in ternal logic may be unstable. therefore, give special consideration to power coupling capacitance, power wiring, width of gnd wiring, and routing of connections. downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class  class  class  b class  class ? class  2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///


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